Charge loss compensation

ABSTRACT

Disclosed in some examples are methods, systems, devices, and machine-readable mediums for compensating for charge loss effects. In some examples, a charge loss may be estimated by a charge loss monitor for a particular unit of a NAND device and may be utilized to select a charge loss compensation scheme. The charge loss may be estimated by the charge loss estimation process by determining a reference read voltage and calculating a bit count resulting from a read at that reference read voltage. The number of bits returned may be used to select the particular charge loss compensation scheme.

FIELD OF INVENTION

Embodiments pertain to memory devices. Some embodiments relate tohandling charge loss and read disturb effects of memory devices.

BACKGROUND

Memory devices for computers or other electronic devices may becategorized as volatile and non-volatile memory. Volatile memoryrequires power to maintain its data, and includes random-access memory(RAM), dynamic random-access memory (DRAM), or synchronous dynamicrandom-access memory (SDRAM), among others. Non-volatile memory canretain stored data when not powered, and includes flash memory,read-only memory (ROM), electrically erasable programmable ROM (EEPROM),static RAM (SRAM), erasable programmable ROM (EPROM), resistancevariable memory, phase-change memory, storage class memory, resistiverandom-access memory (RRAM), and magnetoresistive random-access memory(MRAM), among others.

Flash memory is utilized as non-volatile memory for a wide range ofelectronic applications. Flash memory devices typically include one ormore groups of transistors such as floating gate or charge trap memorycells that allow for high memory densities, high reliability, and lowpower consumption.

Transistor-based memory devices store bits by discriminating chargelevels stored in a transistor. As such, maintaining the appropriatecharge level that correctly represents the bits programmed into the cellis a constant challenge. If the charge level changes after programmingto a charge level that represents a different bit value, an error may beintroduced. Certain operations of the memory device may increase thecharge level of a memory cell. For example, read-disturb errors mayincrease the charge level in a memory cell from the application of aVpass voltage during a read operation to non-selected wordlines. Thehigher the Vpass voltage, the higher the likelihood of introducingerrors. Additionally, charge levels stored in memory cells may decreaseover time through a phenomenon known as charge loss. Both read-disturband charge loss may change the value stored in the memory cell bychanging the voltage level in the cell to a voltage level that does notcorrespond to the value that was programmed into the cell.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, which are not necessarily drawn to scale, like numeralscan describe similar components in different views. Like numerals havingdifferent letter suffixes can represent different instances of similarcomponents.

The drawings illustrate generally, by way of example, but not by way oflimitation, various embodiments discussed in the present document.

FIG. 1 illustrates a diagram of a memory device, such as a storagedevice according to some examples of the present disclosure.

FIG. 2 illustrates an example schematic diagram of a portion of a NANDarchitecture semiconductor memory array according to some examples ofthe present disclosure.

FIG. 3 illustrates an example schematic diagram of a 3D NANDarchitecture semiconductor memory according to some examples of thepresent disclosure.

FIG. 4 illustrates an example block diagram of a memory die according tosome examples of the present disclosure.

FIG. 5 illustrates a charge loss effect according to some examples ofthe present disclosure.

FIG. 6 illustrates a flowchart of a method of charge loss estimationaccording to some examples of the present disclosure.

FIG. 7 illustrates a flowchart of a method for an inline charge losscompensation read command according to some examples of the presentdisclosure.

FIG. 8 illustrates a flowchart of a method of performing a readoperation according to some examples of the present disclosure.

FIG. 9 illustrates a method of performing a background charge lossestimation process according to some examples of the present disclosure.

FIG. 10 illustrates a block diagram of an example machine upon which anyone or more of the techniques (e.g., methodologies) discussed herein maybe performed.

DETAILED DESCRIPTION

Disclosed in some examples are methods, systems, devices, andmachine-readable mediums that compensate for charge loss effects as wellas reduce read-disturb effects by utilizing a charge loss estimationprocess to adjust read parameters of the memory device. In someexamples, a charge loss of a unit (e.g., a page, a block, a plane, adie, or the like) of memory of the memory device may be estimated andutilized to select a charge loss compensation scheme that may includeone or more parameters for performing reads of data in that particularunit of the memory device. Example parameters include a Vpass voltage,one or more read voltage levels, and the like. By adjusting the readvoltage levels, the memory device may reduce read errors by moreaccurately aligning the read voltage levels to adjust for the decreasedcharge in the cells. The charge loss compensation scheme, in addition toreducing charge loss errors through adjustments to read voltages, mayalso reduce the Vpass voltage and therefore reduce read-disturb. This isbecause the Vpass voltage is based upon a highest voltage thatrepresents a stored value in the memory cells. If the memory cells haveshifted to lower voltages as a result of charge loss, the Vpass voltagemay be reduced, which may reduce read-disturb errors.

Memory Device Overview

As previously noted, flash memory is utilized as non-volatile memory fora wide range of electronic applications. Flash memory typically includesone or more groups of transistors such as floating gate or charge trapmemory cells that allow for high memory densities, high reliability, andlow power consumption. Two common types of flash memory arrayarchitectures include NAND and NOR architectures, named after the logicform in which the basic memory cell configuration of each is arranged.The memory cells of the memory array are typically arranged in a matrix.In an example, the gates of each memory cell in a row of the array arecoupled to an access line (e.g., a word line). In a NOR architecture,the drains of each memory cell in a column of the array are coupled to adata line (e.g., a bit line). In a NAND architecture, the drains of eachmemory cell in a string of the array are coupled together in series,source to drain, between a source line and a bit line.

Both NOR and NAND architecture semiconductor memory arrays are accessedthrough decoders that activate specific memory cells by selecting theword line coupled to their gates. In a NOR architecture semiconductormemory array, once activated, the selected memory cells place their datavalues on bit lines, causing different currents to flow depending on thestate at which a particular cell is programmed. In a NAND architecturesemiconductor memory array, a high bias voltage is applied to adrain-side select gate (SGD) line and a source-side select gate (SGS)line. Word lines coupled to the gates of the unselected memory cells ofeach group are driven at a specified pass voltage (e.g., Vpass) tooperate the unselected memory cells of each group as pass transistors(e.g., to pass current in a manner unrestricted by their stored datavalues). Current then flows from the bit line to the source line througheach series coupled group, restricted only by the selected memory cellsof each group, placing current encoded data values of selected memorycells on the bit lines.

Flash memory cells in a NOR or NAND architecture semiconductor memoryarray can be programmed individually or collectively to one or a numberof programmed states. For example, a single-level cell (SLC) canrepresent one of two programmed states (e.g., 1 or 0), representing onebit of data. However, flash memory cells can also represent one of morethan two programmed states, allowing the manufacture of higher densitymemories without increasing the number of memory cells, as each cell canrepresent more than one binary digit (e.g., more than one bit). Suchcells can be referred to as multi-state memory cells, multi-digit cells,or multi-level cells (MLCs). In certain examples, MLC can refer to amemory cell that can store two bits of data per cell (e.g., one of fourprogrammed states), a triple-level cell (TLC) can refer to a memory cellthat can store three bits of data per cell (e.g., one of eightprogrammed states), and a quad-level cell (QLC) can store four bits ofdata per cell. MLC is used herein in its broader context, to can referto any memory cell that can store more than one bit of data per cell(i.e., that can represent more than two programmed states).

Traditional memory arrays are two-dimensional (2D) structures arrangedon a surface of a semiconductor substrate. To increase memory capacityfor a given area, and to decrease cost, the size of the individualmemory cells has decreased. However, there is a technological limit tothe reduction in size of the individual memory cells, and thus, to thememory density of 2D memory arrays. In response, three-dimensional (3D)memory structures, such as 3D NAND architecture semiconductor memorydevices, are being developed to further increase memory density andlower memory cost.

Such 3D NAND devices often include strings of storage cells, coupled inseries (e.g., drain to source), between one or more source-side selectgates (SGSs) proximate a source, and one or more drain-side select gates(SGDs) proximate a bit line. In an example, the SGSs or the SGDs caninclude one or more field-effect transistors (FETs) or metal-oxidesemiconductor (MOS) structure devices, etc. In some examples, thestrings will extend vertically, through multiple vertically spaced tierscontaining respective word lines. A semiconductor structure (e.g., apolysilicon structure) can extend adjacent a string of storage cells toform a channel for the storage cells of the string. In the example of avertical string, the polysilicon structure can be in the form of avertically extending pillar. In some examples the string can be“folded,” and thus arranged relative to a U-shaped pillar. In otherexamples, multiple vertical structures can be stacked upon one anotherto form stacked arrays of storage cell strings.

Memory arrays or devices can be combined together to form a storagevolume of a memory system, such as a solid-state drive (SSD), or one ofvarious forms of managed memory device. Managed memory devices may beconfigured and operated in accordance with recognized industrystandards. For example, managed NAND devices may be (as non-limitingexamples), a Universal Flash Storage (UFS™) device, or an embedded MMCdevice (eMMC™), etc. For example, in the case of the above examples, UFSdevices may be configured in accordance with Joint Electron DeviceEngineering Council (JEDEC) standards such as JEDEC standard JESD223D,entitled “JEDEC UFS Flash Storage 3.0,” and/or updates or subsequentversions to such standard. Similarly, identified eMMC devices may beconfigured in accordance with JEDEC standard JESD84-A51, entitled “JEDECeMMC standard 5.1”, again, and/or updates or subsequent versions to suchstandard.

An SSD can be used as, among other things, the main storage device of acomputer, having advantages over traditional hard drives with movingparts with respect to, for example, performance, size, weight,ruggedness, operating temperature range, and power consumption. Forexample, SSDs can have reduced seek time, latency, or other delayassociated with magnetic disk drives (e.g., electromechanical, etc.).SSDs use non-volatile memory cells, such as flash memory cells toobviate internal battery supply requirements, thus allowing the drive tobe more versatile and compact.

An SSD can include a number of memory devices, including a number ofdies or logical units (e.g., logical unit numbers or LUNs), and caninclude one or more processors or other controllers performing logicfunctions required to operate the memory devices or interface withexternal systems. Such SSDs can include one or more flash memory die,including a number of memory arrays and peripheral circuitry thereon.The flash memory arrays can include a number of blocks of memory cellsorganized into a number of physical pages. In many examples, the SSDswill also include DRAM or SRAM (or other forms of memory die or othermemory structures). The SSD can receive commands from a host inassociation with memory operations, such as read or write operations totransfer data (e.g., user data and associated integrity data, such aserror data and address data, etc.) between the memory devices and thehost, or erase operations to erase data from the memory devices.

Memory devices include individual memory die, which may, for example,include including a storage region comprising one or more arrays ofmemory cells, implementing one (or more) selected storage technologies.Such memory die will often include support circuitry for operating thememory array(s). Other examples, sometimes known generally as “managedmemory devices,” include assemblies of one or more memory die associatedwith controller functionality configured to control operation of the oneor more memory die. Such controller functionality can simplifyinteroperability with an external device, such as a “host” as discussedlater herein. In such managed memory devices, the controllerfunctionality may be implemented on one or more die also incorporating amemory array, or on a separate die). In other examples, one or morememory devices may be combined with controller functionality to form asolid-stage drive (SSD) storage volume. The term “memory system,” isused herein as inclusive of one or more memory die, and any controllerfunctionality for such memory die, when present; and thus, includesindividual memory devices, managed memory devices, and SSDs.

For purposes of the present description, example embodiments includemanaged memory devices implementing NAND flash memory cells, termed“managed NAND” devices. Such managed NAND devices may be constructed andoperated generally in accordance with the described JEDEC UFS FlashStorage 3.0 specification, as may be modified as appropriate toincorporate the structures and functionality described herein. However,the described functionality may be implemented with other types ofmemory devices, as described above, which may incorporate other storagetechnologies, a few non-limiting examples of which were discussedearlier herein; and may be configured for operation in accordance withother industry standards, as discussed above; or in accordance withnon-industry standard protocols.

Electronic devices, such as mobile electronic devices (e.g., smartphones, tablets, etc.), electronic devices for use in automotiveapplications (e.g., automotive sensors, control units, driver-assistancesystems, passenger safety or comfort systems, etc.), andinternet-connected appliances or devices (e.g., internet-of-things (IoT)devices, etc.), have varying storage needs depending on, among otherthings, the type of electronic device, use environment, performanceexpectations, etc.

Electronic devices can be broken down into several main components: aprocessor (e.g., a central processing unit (CPU) or other mainprocessor); memory (e.g., one or more volatile or non-volatilerandom-access memory (RAM) memory device, such as dynamic RAM (DRAM),mobile or low-power double-data-rate synchronous DRAM (DDR SDRAM),etc.); and a storage device (e.g., non-volatile memory (NVM) device,such as flash memory, read-only memory (ROM), an SSD, an MMC, or othermemory card structure or assembly, etc.). In certain examples,electronic devices can include a user interface (e.g., a display,touch-screen, keyboard, one or more buttons, etc.), a graphicsprocessing unit (GPU), a power management circuit, a baseband processoror one or more transceiver circuits, etc.

FIG. 1 illustrates a diagram of a memory device 100, such as a storagedevice according to some examples of the present disclosure. Memorydevice 100 may include one or more host interfaces 123 which may utilizeone or more protocols such as a Serial Advanced Technology Attachment(SATA) interface, a Peripheral Component Interconnect Express (PCIe)interface, a Universal Serial Bus (USB) interface, a Universal FlashStorage (UFS) interface, an eMMC™ interface, or one or more otherconnectors or interfaces to communicate with a host device 135. Host 135may send one or more commands, such as read comments, write commands,erase commands, and the like to the memory device 100 through the hostinterface 123. Host interface 123 may be part of controller 105 or maybe implemented by separate circuitry.

Memory device 100 may include one or more memory controllers 105.Controller 105 may include processing circuitry 110 which may includeone or more hardware processors 115. Processors 115 may be generalpurpose hardware processors that execute firmware or other softwareinstructions for performing operations of the memory device, includingimplementing the host interface 123 and memory die interface 125. Inother examples, the processor(s) 115 may be special purpose hardwareprocessors that are specifically designed to perform the operations ofthe memory device 100 through hardware logic and/or through theexecution of software instructions. Processing circuitry 110 may alsoinclude logic circuits and other circuit components configured toperform various control functionality and memory management operations,or portions thereof, examples of which are described below.

In the depicted example, memory device 100 includes a host interface 123providing communication through a host bus 137 to external host device135. The configuration of host interface 123 may be of various formsdepending upon the specific configuration of memory device 100 (whichmay also be termed a “memory system”). For example, in an example inwhich memory device 100 is a UFS device, the host interface will be inaccordance with the applicable UFS standard.

Memory device 100 also incorporates one or more memory die interfaces125 between the processing circuitry 110 of the controller 105 and atleast some portion of the memory dies 130-A 130N+1 within memory device100. Memory die interface 125 may be part of controller 105 or may beimplemented by separate circuitry. For example, in the example of a UFSdevice, one or more of the memory die interfaces 125 will be a suitablememory interface, for example an Open NAND Flash Interface (“ONFI”),such as that defined by the ONFI 4.0 Specification, or later versions orrevisions thereof.

Components of the memory device 100, such as controller 105, may includea random-access memory 120 for performing the operations of the memorydevice 100. The random-access memory 120 may be separate from thecontroller 105 or, as shown, may be integrated in the controller 105.

Controller 105 may handle one or more functions of the memory byinteracting with the memory cells of the memory device that are part ofone or more memory dies 130-A-130N+1. A schematic of an exampleimplementation of a memory die 130 is shown in FIG. 4. The controller105 may communicate with these memory dies through the memory dieinterface 125 across a memory die bus 127. In some examples, the memorydies may have their own device controllers, including processingcircuitry and processors, to control operations on the respective memorydie. Such device controllers may be formed on a common die with thedevice storage array or may be on a separate die from that containingthe device storage array. Both configurations are embraced by theidentified “memory die” (130A-N+1) described herein. Memory dies may beNAND dies, three-dimensional NAND dies, phase change memory dies, andthe like.

The host device 135 may be a personal computer, a smartphone, a tablet,a portion of an integrated circuit, an Internet of Things (IoT) device(e.g., a refrigerator or other appliance, sensor, motor or actuator,mobile communication device, automobile, drone, etc.), or the like.

For purposes of the present description example memory operation andmanagement functions may be described in the context of NAND memory.Persons skilled in the art will recognize that other forms ofnon-volatile memory may have analogous memory operations or managementfunctions. Such NAND management functions include wear leveling (e.g.,garbage collection or reclamation), error detection or correction, blockretirement, or one or more other memory management functions.

The memory dies 130-A-130-N+1 can include several memory cells arrangedin, for example, a number of planes, sub-blocks, blocks, or pages. Asone example, a 48 GB TLC NAND memory device can include 18,592 bytes (B)of data per page (16,384+2208 bytes), 1536 pages per block, 548 blocksper plane, and 4 or more planes per device. As another example, a 32 GBMLC memory device (storing two bits of data per cell (i.e., 4programmable states)) can include 18,592 bytes (B) of data per page(16,384+2208 bytes), 1024 pages per block, 548 blocks per plane, and 4planes per device, but with half the required write time and twice theprogram/erase (P/E) cycles as a corresponding TLC memory device. Otherexamples can include other numbers or arrangements. In some examples, amemory device, or a portion thereof, can be selectively operated in SLCmode, or in a desired MLC mode (such as TLC, OLC, etc.).

In operation, data is typically written to or read from the memorydevice 100 in pages and erased in blocks. However, one or more memoryoperations (e.g., read, write, erase, etc.) can be performed on largeror smaller groups of memory cells, as desired. The data transfer size ofa memory device 100 is typically referred to as a page, whereas the datatransfer size of a host is typically referred to as a sector.

Although a page of data can include a number of bytes of user data(e.g., a data payload including a number of sectors of data) and itscorresponding metadata, the size of the page often refers only to thenumber of bytes used to store the user data. As an example, a page ofdata having a page size of 4 KB can include 4 KB of user data (e.g., 8sectors assuming a sector size of 512 B) as well as a number of bytes(e.g., 32 B, 54 B, 224 B, etc.) of metadata corresponding to the userdata, such as integrity data (e.g., error detecting or correcting codedata), address data (e.g., logical address data, etc.), or othermetadata associated with the user data.

Different types of memory cells can provide for different page sizes orcan require different amounts of metadata associated therewith. Forexample, different memory device types can have different bit errorrates, which can lead to different amounts of metadata necessary toensure integrity of the page of data (e.g., a memory device with ahigher bit error rate can require more bytes of error correction codedata than a memory device with a lower bit error rate). As an example, amulti-level cell (MLC) NAND flash device can have a higher bit errorrate than a corresponding single-level cell (SLC) NAND flash device. Assuch, the MLC device can require more metadata bytes for error data thanthe corresponding SLC device.

FIG. 2 illustrates an example schematic diagram of a portion of a NANDarchitecture semiconductor memory array 300 including a plurality ofmemory cells 202 arranged in a two-dimensional array of strings (e.g.,strings 205-207) and tiers (e.g., illustrated as respective word lines(WL) WL0-WL7 210-217, a drain-side select gate (SGD) line 225, asource-side select gate (SGS) line 230, etc.), and sense amplifiers ordevices 260 according to some examples of the present disclosure. Forexample, the memory array 200 can illustrate an example schematicdiagram of a portion of one physical page of memory cells of a memorydie 130 from FIG. 1.

Each string of memory cells is coupled to a source line (SRC) 235 usinga respective source-side select gate (SGS) (e.g., SGS 231-233), and to arespective data line (e.g., bit lines (BL) BL0-BL2 220-222) using arespective drain-side select gate (SGD) (e.g., SGDs 226-228). Althoughillustrated with 8 tiers (e.g., using word lines (WL) WL0-WL7 210-217)and three data lines (BL0-BL2 226-228) in the example of FIG. 2, otherexamples can include strings of memory cells having more or fewer tiersor data lines, as desired.

In a NAND architecture semiconductor memory array, such as the examplememory array 200, the state of a selected memory cell 202 can beaccessed by sensing a current or voltage variation associated with aparticular data line containing the selected memory cell. The memoryarray 200 can be accessed (e.g., by a control circuit, one or moreprocessors, digital logic, etc.) using one or more drivers. In anexample, one or more drivers can activate a specific memory cell, or setof memory cells, by driving a particular potential to one or more datalines (e.g., bit lines BL0-BL2), access lines (e.g., word linesWL0-WL7), or select gates, depending on the type of operation desired tobe performed on the specific memory cell or set of memory cells.

To program or write data to a memory cell, a programming voltage (Vpgm)(e.g., one or more programming pulses, etc.) can be applied to selectedword lines (e.g., WL4), and thus, to a control gate of each memory cellcoupled to the selected word lines (e.g., control gates (CGs) 241-243 ofthe memory cells coupled to WL4). Programming pulses can begin, forexample, at or near 15V, and, in certain examples, can increase inmagnitude during each programming pulse application. While the programvoltage is applied to the selected word lines, a potential, such as aground potential (e.g., Vss), can be applied to the data lines (e.g.,bit lines) and substrates (and thus the channels, between the sourcesand drains) of the memory cells targeted for programming, resulting in acharge transfer (e.g., direct injection or Fowler-Nordheim (FN)tunneling, etc.) from the channels to the charge storage structures ofthe targeted memory cells. Such charge storage structures may include,for example floating gates or charge trap regions of the respectivememory cells. In floating gate memory cells charge is stored in anisolated polysilicon structure; while in charge trap memory cells thecharge is typically stored in a dielectric structure.

In contrast, a pass voltage (Vpass) can be applied to one or more wordlines having memory cells that are not targeted for programming, or aninhibit voltage (e.g., Vcc) can be applied to data lines (e.g., bitlines) having memory cells that are not targeted for programming, forexample, to inhibit charge from being transferred from the channels tothe charge storage structures of such non-targeted memory cells. Thepass voltage can be variable, depending, for example, on the proximityof the applied pass voltages to a word line targeted for programming.The inhibit voltage can include a supply voltage (Vcc), such as avoltage from an external source or supply (e.g., a battery, an AC-to-DCconverter, etc.), relative to a ground potential (e.g., Vss).

As an example, if a programming voltage (e.g., 15V or more) is appliedto a specific word line, such as WL4, a pass voltage of 10V can beapplied to one or more other word lines, such as WL3, WL5, etc., toinhibit programming of non-targeted memory cells, or to retain thevalues stored on such memory cells not targeted for programming. As thedistance between an applied program voltage and the non-targeted memorycells increases, the pass voltage required to refrain from programmingthe non-targeted memory cells can decrease. For example, where aprogramming voltage of 15V is applied to WL4, a pass voltage of 10V canbe applied to WL3 and WL5, a pass voltage of 8V can be applied to WL2and WL6, a pass voltage of 7V can be applied to WL1 and WL7, etc. Inother examples, the pass voltages, or number of word lines, etc., can behigher or lower, or more or less.

The sense amplifiers 260, coupled to one or more of the data lines(e.g., first, second, or third bit lines (BL0-BL2) 220-222), can detectthe state of each memory cell in respective data lines by sensing avoltage or current on a particular data line.

Between applications of one or more programming pulses (e.g., Vpgm), averify operation can be performed to determine if a selected memory cellhas reached its intended programmed state. If the selected memory cellhas reached its intended programmed state, it can be inhibited fromfurther programming. If the selected memory cell has not reached itsintended programmed state, additional programming pulses can be applied.If the selected memory cell has not reached its intended programmedstate after a particular number of programming pulses (e.g., a maximumnumber), the selected memory cell, or a string, block, or pageassociated with such selected memory cell, can be marked as defective.

For Single Level Cells (SLC), there are two possible voltage levelsprogrammed into the cell, one voltage level represents a binary ‘1’ andanother voltage level represents a binary ‘0’ For Multi-Level Cells(MLC), there are four possible voltage levels programmed into the cell.The four possible voltage levels represent ‘00’, ‘01110’, and ‘11’. Toprogram an MLC cell, multiple programming pulses are applied. A firstpulse programs a first “page” of data that represents either the mostsignificant bit or least significant bit of the cell. A second pulseprograms the second “page” of data that represents the other bit of thecell that was not programmed by the first pulse. Similarly, Triple LevelCells (TLC) store eight possible voltage levels and Quad Level Cells(QLCs) store 16 possible voltage levels.

To read a value stored in one or more memory cells, a read voltage isapplied to the wordline of the selected cells. A different voltage ispassed to the sense amplifier depending on whether the voltage stored inthe cells is less than or greater than the read voltage. For an SLCcell, the read voltage is selected to be between the two voltagesrepresenting a ‘1’ and a ‘0,’ For MLC, TLC, and QLC, multiple readoperations are used to read each bit stored in the cell—each readoperation utilizes a different read voltage.

To erase a memory cell or a group of memory cells (e.g., erasure istypically performed in blocks or sub-blocks), an erase voltage (Vers)can be applied to the substrates (and thus the channels, between thesources and drains) of the memory cells targeted for erase (e.g., usingone or more bit lines, select gates, etc.), while the word lines of thetargeted memory cells are kept at a potential, such as a groundpotential (e.g., Vss), resulting in a charge transfer (e.g., directinjection or Fowler-Nordheim (FN) tunneling, etc.) from the chargestorage structures of the targeted memory cells to the channels.

FIG. 3 illustrates an example schematic diagram of a 3D NANDarchitecture semiconductor memory array 300 including a number ofstrings of memory cells (e.g., A₀ memory strings 305A₀-307A₀, A_(n)memory strings 305A_(n)-307A_(n), B₀ memory strings 305B₀-307B₀, B_(n)memory strings 305B_(n)-307B_(n), etc.), organized in blocks (e.g.,block A 301A, block B 301B, etc.) and sub-blocks (e.g., sub-block A₀301A₀, sub-block A_(n) 301A_(n), sub-block B₀ 301B₀, sub-block B_(n)301B_(n), etc.). The memory array 300 represents a portion of a greaternumber of similar structures that would typically be found in a block,device, or other unit of a memory device.

Each string of memory cells includes a number of tiers of charge storagetransistors (e.g., floating gate transistors, charge-trappingstructures, etc.) stacked in the Z direction, source to drain, between asource line (SRC) 335 or a source-side select gate (SGS) (e.g., A₀ SGS331A₀-333A₀, A_(n) SGS 331A_(n)-333A_(n), B₀ SGS 331B₀-333B₀, B_(n) SGS231B_(n)-233B_(n), etc.) and a drain-side select gate (SGD) (e.g., A₀SGD 326A₀-328A₀, A_(n) SGD 326A_(n)-328A_(n), B₀ SGD 326B₀-328B₀, B_(n)SGD 326B_(n)-328B_(n), etc.). Each string of memory cells in the 3Dmemory array can be arranged along the X direction as data lines (e.g.,bit lines (BL) BL0-BL2 320-322), and along the Y direction as physicalpages.

Within a physical page, each tier represents a row of memory cells, andeach string of memory cells represents a column. A sub-block can includeone or more physical pages. A block can include a number of sub-blocks(or physical pages) (e.g., 128, 256, 384, etc.). Although illustratedherein as having two blocks, each block having two sub-blocks, eachsub-block having a single physical page, each physical page having threestrings of memory cells, and each string having 8 tiers of memory cells,in other examples, the memory array 300 can include more or fewerblocks, sub-blocks, physical pages, strings of memory cells, memorycells, or tiers. For example, each string of memory cells can includemore or fewer tiers (e.g., 16, 32, 64, 128, etc.), as well as one ormore additional tiers of semiconductor material above or below thecharge storage transistors (e.g., select gates, data lines, etc.), asdesired. As an example, a 48 GB TLC NAND memory device can include18,592 bytes (B) of data per page (16,384+2208 bytes), 1536 pages perblock, 548 blocks per plane, and 4 or more planes per device.

Each memory cell in the memory array 300 includes a control gate (CG)coupled to (e.g., electrically or otherwise operatively connected to) anaccess line (e.g., word lines (WL) WL0 o-WL7 o 310A-317A, WL0 ₁-WL7 ₁310B-317B, etc.), which collectively couples the control gates (CGs)across a specific tier, or a portion of a tier, as desired. Specifictiers in the 3D memory array, and accordingly, specific memory cells ina string, can be accessed or controlled using respective access lines.Groups of select gates can be accessed using various select lines. Forexample, A₀ SGD 326A₀-328A₀ can be accessed using an A₀ SGD line SGDA₀325A₀, A_(n) SGD 326A_(n)-328A_(n) can be accessed using an SGD lineSGDA_(n) 325A_(n), B₀ SGD 326B₀-328B₀ can be accessed using an B₀ SGDline SGDB₀ 325B₀, and B_(n) SGD 326B_(n)-328B_(n) can be accessed usingan B_(n) SGD line SGDB_(n) 325B_(n). A₀ SGS 331A₀-333A₀ and A_(n) SGS331A_(n)-333A_(n) can be accessed using a gate select line SGS₀ 330A,and B₀ SGS 331B₀-333B₀ and B_(n) SGS 331B_(n)-333B_(n) can be accessedusing a gate select line SGS₁ 330B.

In an example, the memory array 300 can include a number of levels ofsemiconductor material (e.g., polysilicon, etc.) configured to couplethe control gates (CGs) of each memory cell or select gate (or a portionof the CGs or select gates) of a respective tier of the array. Specificstrings of memory cells in the array can be accessed, selected, orcontrolled using a combination of bit lines (BLs) and select gates,etc., and specific memory cells at one or more tiers in the specificstrings can be accessed, selected, or controlled using one or moreaccess lines (e.g., word lines).

FIG. 4 illustrates an example block diagram of a memory die 400including a memory array 402 having a plurality of memory cells 404, andone or more circuits or components to provide communication with, orperform one or more memory operations on, the memory array 402 accordingto some examples of the present disclosure. The memory die 400 caninclude a row decoder 412, a column decoder 414, sense amplifiers 420, apage buffer 422, a selector 424, an input/output (I/O) circuit 426, anda memory control unit 430.

The memory cells 404 of the memory array 402 can be arranged in blocks,such as first and second blocks 402A, 402B. Each block can includesub-blocks. For example, the first block 402A can include first andsecond sub-blocks 402A₀, 402A_(n), and the second block 402B can includefirst and second sub-blocks 402B₀, 402B_(n). Each sub-block can includea number of physical pages, each page including a number of memory cells404. Although illustrated herein as having two blocks, each block havingtwo sub-blocks, and each sub-block having a number of memory cells 404,in other examples, the memory array 402 can include more or fewerblocks, sub-blocks, memory cells, etc. In other examples, the memorycells 404 can be arranged in a number of rows, columns, pages,sub-blocks, blocks, etc., and accessed using, for example, access lines406, first data lines 410, or one or more select gates, source lines,etc.

The memory control unit 430 can control memory operations of the memorydevice 400 according to one or more signals and/or instructions/commandsreceived on control lines 432 at a memory interface with a memorycontroller (as described relative to controller 105 and host interface123 of memory device 100 of FIG. 1. Such signals and/or instructions mayinclude, for example, one or more clock signals and/or control signalsthat indicate a desired operation (e.g., write, read, erase, etc.), oraddress signals (A0-AX) received on one or more address lines 416. Oneor more devices external to the memory device 400 can control the valuesof the control signals on the control lines 432, or the address signalson the address line 416. Examples of devices external to the memorydevice 400 can include, but are not limited to, a host, a memorycontroller, a processor, or one or more circuits or components notillustrated in FIG. 4.

The memory die 400 can use access lines 406 and first data lines 410 totransfer data to (e.g., write or erase) or from (e.g., read) one or moreof the memory cells 404. The row decoder 412 and the column decoder 414can receive and decode the address signals (A0-AX) from the address line416, can determine which of the memory cells 404 are to be accessed, andcan provide signals to one or more of the access lines 406 (e.g., one ormore of a plurality of word lines (WL0-WLm)) or the first data lines 410(e.g., one or more of a plurality of bit lines (BL0-BLn)), such asdescribed above.

The memory die 400 can include sense circuitry, such as the senseamplifiers 420, configured to determine the values of data on (e.g.,read), or to determine the values of data to be written to, the memorycells 404 using the first data lines 410. For example, in a selectedstring of memory cells 404, one or more of the sense amplifiers 420 canread a logic level in the selected memory cell 404 in response to a readcurrent flowing in the memory array 402 through the selected string tothe data lines 410.

One or more devices external to the memory die 400, such as a controller105, can communicate with the memory die 400 using the I/O lines(DOG-DON) 408, address lines 416 (A0-AX), or control lines 432. Theinput/output (I/O) circuit 426 can transfer values of data in or out ofthe memory device 400, such as in or out of the page buffer 422 or thememory array 402, using the I/O lines 408, according to, for example,the control lines 432 and address lines 416. The page buffer 422 canstore data received from the one or more devices external to the memorydevice 400 before the data is programmed into relevant portions of thememory array 402 or can store data read from the memory array 402 beforethe data is transmitted to the one or more devices external to thememory device 400.

The column decoder 414 can receive and decode address signals (A0-AX)into one or more column select signals (CSEL1-CSELn). The selector 424(e.g., a select circuit) can receive the column select signals(CSEL1-CSELn) and select data in the page buffer 422 representing valuesof data to be read from or to be programmed into memory cells 404.Selected data can be transferred between the page buffer 422 and the I/Ocircuit 426 using second data lines 418. In some examples a flashtranslation layer (not shown) can map addresses provided by a host tophysical memory addresses used by the row decoder 412 and column decoder414 to read data in the memory array 402.

The memory control unit 430 can receive positive and negative supplysignals, such as a supply voltage (Vcc) 434 and a negative supply (Vss)436 (e.g., a ground potential), from an external source or supply (e.g.,an internal or external battery, an AC-to-DC converter, etc.). Incertain examples, the memory control unit 430 can include a regulator428 to internally provide positive or negative supply signals.

Charge Loss Compensation

As previously noted, charge loss may affect the charge stored on one ormore memory cells and therefore affect the value read by the memorydevice. This charge loss may be compensated for by estimating the chargeloss and using that estimate to select a charge loss compensationscheme.

In some examples, the charge loss may be estimated by a charge lossestimation process by determining a charge loss estimation read voltage;reading a page or other unit of the memory device by applying the chargeloss estimation read voltage to the unit; and calculating a total bitcount resulting from the read at the charge loss estimation readvoltage. The bit count may be an estimation of the charge loss as itrepresents a number of bits counted at a particular charge lossestimation read voltage. That bit count will change over time. Forexample, if at time t1, 100 bits are expected to be read out of a pageof data after application of the charge loss estimation read voltage,then at a later time t2, a different (e.g., fewer) number of bits may beread. The number of bits returned by this read may be used to select acharge loss compensation scheme that specifies one or more parameterssuch as Vpass and read voltage levels.

Calculating the charge loss and applying charge loss compensation forevery read operation may be too computationally expensive and may resultin undesirable wear to the memory device. Instead, in some examples, thecharge loss estimation process may execute as a background task that mayperiodically sample various memory units (e.g., pages, blocks, planes,dies, and the like) and estimate a charge loss for those sampled units.The system may use the sampled units to estimate the charge loss forunsampled units. The background charge loss estimation process mayexecute with a defined periodicity, when the memory device is idle (orhas been idle fora particular threshold period of time), on demand(e.g., when requested by the host), or the like.

The number of units sampled by the background task and which units tosample may be calculated or specified. For example, the number of unitsto sample may vary based upon the number of uncorrectable ECC errorsexperienced by one or more units of the memory device, an age of one ormore units of the memory device, an age of data written to the one ormore units of the memory device, and the like. For example, as thememory device experiences more ECC errors, that suggests that chargeloss may be greater than estimated and so the memory device may sampleadditional units to calibrate itself better. Additionally, as the age ofthe particular unit of memory increases, a charge loss may accelerate asthe unit may not hold charge as well. Furthermore, as the age of thedata written to a unit of the memory device increases, charge losserrors to that unit may be more likely. The sampled units may be changedover time, such that two successive executions of the background processmay not sample the same units. The units selected for sampling may bedone based upon a schedule. In some examples, units experiencing errorsabove a threshold, units with an age of data programmed onto the unitthat are greater than a threshold, units that are written asrandom-access data, or the like may be selected at a greater frequency.

As previously noted, the system may use the sampled units to estimatethe charge loss for unsampled units. For example, unsampled units withina same level of a memory device hierarchy as a sampled unit may beassigned a same or similar charge loss estimation, or otherwise may havea charge loss estimated based upon the sampled units within that levelof hierarchy. For example, a first page in a first block may be selectedand may have an estimated charge loss of x. A second page in the samefirst block may be unselected. The system may estimate the charge lossof the second page based upon the estimated charge loss of the firstpage. In some examples, the second page may have an estimated chargeloss of x or an estimated charge loss that is different than x but basedupon x—e.g., using x in a formula.

In examples in which multiple samples are taken for a particular memorydevice unit (e.g., multiple pages in a block), the memory device may useall of the samples (e.g., an average) to calculate the estimated chargeloss for the entire unit. For example, an average of all the sampledcharge losses in a block may be used to estimate the charge loss for allpages within the block. In yet other examples, each sampled unit may beweighted in a formula to calculate an estimate of the charge loss. Theweighting may be based according to one or more of: a physicalproximity, a temporal proximity, an access type, and/or the like.

In other examples, a non-selected unit may be estimated using some, butnot all the selected units. Which selected units are used for estimatingthe charge loss for a given un-selected unit may depend on a physicalproximity to the unselected unit (e.g., one or more selected unitsphysically proximate to the unselected units may be used), a temporalproximity to the unselected unit (e.g., one or more selected units thatwere written closest in time to the unselected unit), an access typematch to the unselected unit (e.g., random access or sequential access),and the like. In some examples, the selected units that are used forestimating the charge loss for a given un-selected unity may be weightedin a formula to calculate an estimate of the charge loss. The weightingmay be based according to one or more of a: physical proximity, atemporal proximity, an access type, and/or the like.

The estimated charge loss may then be used to select a charge losscompensation scheme. For example, a parameter may be calculated by aformula that has, as an input, the estimated charge loss. In otherexamples, the estimated charge loss, as represented by the bit countreturned by the charge loss estimation process may be used as a key in alookup table. That is, the lookup table may specify ranges of returnedbits (e.g., a minimum and maximum) and a corresponding charge losscompensation scheme for that range. If the returned bits fall within aparticular range specified by a particular charge loss compensationscheme, the system selects that particular charge loss compensationscheme.

In some examples, the charge loss compensation scheme as estimated bythe background process (for both unselected and selected memory cells ofthe background charge loss estimation process) may be applied for allread requests. In other examples, the charge loss compensation schememay be applied for read requests that first experience errors using readparameters that were not compensated for charge loss. In still otherexamples, the charge loss compensation scheme determined by thebackground process may only apply to specially designated reads.

In some examples, a controller of the memory device may determine thatone or more reads are more likely to have a charge loss condition or maycontain more important data where minimizing errors may be moreimportant than speed. To handle this situation, the controller of thememory device may specifically execute a special charge losscompensation (CLC) read on the particular unit of data. This CLC readmay first attempt to read the unit of data using the charge losscompensation scheme estimated based upon the background process. In someexamples, if an Error Correction Code limit is exceeded for this CLCread (e.g., the number of uncorrectable KC errors exceeds a threshold),then the charge loss estimation process determines an updated chargeloss compensation scheme for the particular pages that are being readrather than use the CLC scheme estimated as a result of the sampled dataunits in the background process. This results in a more accurate CLCestimation. The memory device re-reads the unit of data using theparameters in the updated charge loss compensation scheme.

By the combined use of background operations and on-demand operationsfor sensitive or at-risk data, the system may minimize both charge losseffects and read disturb errors by adjusting both the read voltages andthe Vpass voltages. This is done without introducing significant delayon most read operations while also limiting the wear on the NAND device.For data that is at-risk or sensitive, the system may utilize moreintensive operations that may still produce a faster read whenconsidering the error handling that may be avoided by updating the readoperations for charge loss effects.

FIG. 5 illustrates a charge loss effect according to some examples ofthe present disclosure. Charge distribution plot 500 shows variousexample charge distributions for each of eight possible states of a TLCmemory cell just after programming. Each parabola shows an expectedcharge distribution for each potential value of a TLC memory cell. Forexample, the leftmost parabola may represent expected charge levels fora bit value of ‘111’ in some examples. Other parabolas represent otherpotential bit values. The charge distribution represents the expectedprobabilities of each charge level for a given bit value.

Charge distribution plots 505 and 510 show the effects of time on thecharge distributions from charge distribution plot 500. Chargedistribution plots 505 shows that after a period of time t1 has elapsedsince programming, the charge distributions shift as a result of chargeloss. An example reference read voltage 515, when used with chargedistributions in charge distribution plot 500, properly aligns betweenthe last two charge distributions and would be useful in distinguishingbetween those corresponding bit values. However, at charge distributionplots 505, the reference read voltage 515 is now in the middle of thelast distribution. In these examples, whether the correct value is readwith this reference voltage depends on whether the actual charge storedin the cell falls on the right half or left half of the distribution.

Charge distribution plot 510 shows expected charge distributions after aperiod of time t2 from programming (where t2 is greater than t1). Inthis charge distribution plot, all the charge distributions have shiftedleftward enough that the reference read voltage 515 is likely to producean incorrect result for most reads.

To prevent read errors, memory devices need to account for charge loss.For example, by shifting the reference read voltages depending on theamount of charge lost. At time t1 after programming, the reference readvoltage may be shifted from 515 to 517 and at time t2 after programming,the reference read voltage may be shifted even further to 519. Theamount to shift the read voltage may be determined using a charge losscompensation scheme.

Additionally, a Vpass voltage may also be adjusted. As previouslydescribed, the Vpass voltage is selected to be a voltage level higherthan a voltage of the greatest distribution stored in the cell toguarantee that the cell passes a charge and to avoid a charge stored ina non-selected wordline from interfering with the read operation of theselected wordline. Vpass voltage however is not without its undesirableeffects. For example, non-selected wordlines may gain charge afterrepeated applications of Vpass voltage. To reduce these effects, as aparticular memory cell loses charge, it becomes possible to takeadvantage of the charge loss by reducing the Vpass voltage to reduceunwanted read-disturb effects. For example, at time t1 afterprogramming, the Vpass that was initially at line 520 may be a reducedVpass at line 530. At time t2 after programming, the Vpass may move evenfurther to 540.

In order to accurately set both the various read voltages and the Vpassvoltages, the memory device needs to have an accurate way of measuringcharge loss. In some examples, a charge loss estimation process executedby the memory device may estimate charge loss by reading a page or otherunit of memory at a charge loss estimation read voltage. In someexamples, the charge loss estimation read voltage may be a read voltagethat is estimated to be between a highest and second highest voltagedistribution at the time of programming. In other examples, the chargeloss estimation read voltage may be set to other values (e.g., betweenother distributions, or even within a distribution). This voltage may bea prespecified voltage or may be calculated on the fly. The number ofbits read at that voltage may be used to determine the charge losscompensation scheme. For example, a table may have rows of chargecompensation schemes with associated upper- and lower-bit count ranges.The charge loss compensation scheme may specify modifications to one ormore parameters of the memory device such as Vpass and/or various readvoltages.

As previously described, while performing a charge loss compensationprocess may reduce an error rate and reduce read-disturb effects, theseprocesses may be computationally expensive when applied to each read ofthe memory. Instead of applying this process to all reads, in someexamples, the memory device may estimate charge loss in a backgroundoperation. For example, when the memory device is idle (or has been idlefor a particular period of time), the memory device may read thecontents of a unit of memory comprising a memory cell or a group ofmemory cells (e.g., a page, block, and the like) and may calculate acharge loss compensation scheme for that unit. As noted earlier herein,charge loss compensation scheme may be implemented in various forms suchas being applicable to only those memory cells for which the charge losscompensation was estimated during background scans, may apply to allmemory cells within a particular same hierarchical level of memory cellsas the selected memory cells (e.g., every page within a same block, allthe blocks within a same superblock), or other physical and/or temporalallocations, as desired.

In some examples, and as previously noted, the charge compensationscheme may be estimated for non-sampled memory cells based upon thecharge compensation estimate of the sampled memory cells. In someexamples, data that is written at a point in time that is similar tothat of the sampled memory cells may have similar charge loss and may beadjusted similarly. For example, memory cells that are written within athreshold time of a sampled memory cell may have a same charge losscompensation scheme applied as the sampled memory cell.

FIG. 6 illustrates a flowchart of a method 600 of charge loss estimationaccording to some examples of the present disclosure. At operation 610,the controller may determine the appropriate charge loss estimation readvoltage. For example, a charge loss estimation read voltage may bespecified that allows the system to track charge loss over time. Forexample, reading all cells of a given page, block, or die with thereference read voltage 515 of FIG. 5 would return a number of storedbits that have voltage levels above the charge loss estimation readvoltage level for the time right after programming, a smaller number ofbits at time programming+t1, and an even smaller number of bits at timeprogramming+t2. In some examples, the charge loss estimation readvoltage may be a prespecified value that may be an approximation of aread voltage between the two highest expected voltage distributions inthe memory cells.

At operation 615, the controller may cause the memory cells making up aunit of memory (e.g., a page, a block, a die, a superblock) to be readat the read voltage determined at operation 610. At operation 620, thememory device may count the number of bits read at this voltage. Atoperation 630, the memory device may select a charge loss compensationscheme based upon the number of bits counted at operation 620. Forexample, a table may correlate a number of bits to particular chargeloss compensation scheme. For example:

VPASS BITS RETRY ADJUSTMENT  0-100 RR7 −600 mv  101-1000 RR6 −400 mv 1001-10000 RR5 −200 mv 10001-16000 RR4 N/A

In some examples, the number of bits and the corresponding read-retrylevel may be a statistical approximation. For example, afterprogramming, the number of bits above the reference read level (whichmay be a read level between the last two distributions) may beapproximately ⅛^(th) of the number of bits in a 16 KB page for a TLCpage. This is because there are 8 distributions in a TLC cell and whenthe data is randomized across the entire 16 KB page, each distributionwill have approximately the same number of bits—or ⅛^(th). The number ofbits in a 16 KB page is 16*1024*8 bits=131,072 bits. Since it is likelyover that many bits that each bit is represented equally, 131,072divided by 8, equals 16,384. As time passes after programming, more andmore bits shift lower—e.g., fewer bits are above the reference readthreshold (which, in some examples, is between the last twodistributions).

The bit count of the given page, block, or die may be used as an indexto select a row of the table with device parameters. “Retry”—which mayspecify one or more reference read voltage levels for either the initialread, or a retry read; and a VPass adjustment value. The table may besuch that between 0 bits and 100 bits, the retry parameter is RR7 andthe VPass value reduced by 600 mv; between 101-1000 bits, the retryparameter is RR6 and the VPass value is calculated by subtracting 400 mvfrom a reference or default VPass value; between 1001 and 10000 theretry parameter is RR5 and the VPass is calculated by subtracting 200 mvfrom a reference or default VPass value; between 10001 and 16000 bits,the retry value is RR4 and the VPass is a reference or default VPassvalue. One of ordinary skill in the art with the benefit of the presentdisclosure will appreciate that the table above is exemplary and otherranges and other values may be utilized.

In other examples, rather than being ranges, one or more of theparameters may be determined based upon a function of the number of bitsthat are counted or a difference between the number of bits counted anexpected number of bits. The function may be linear, quadratic, or thelike and may output a charge loss compensation scheme parameter basedupon the input number of bits.

As previously noted, the method 600 may be performed as a backgroundprocess that may sample one or more data units such as a page, block,die, or the like. The number of bits read after applying the charge lossestimation read voltage to each sample may be used to set a charge losscompensation scheme for the sampled data units. The sampled data unitsmay be used to set a charge loss compensation scheme for unsampled dataunits. For example, by estimating a charge loss compensation scheme fora particular unsampled unit from the estimation of the charge loss of asampled unit. The estimation may factor in a physical distance betweenthe unsampled unit and a sampled unit, a correspondence between when thesampled unit was written and when the unsampled unit was written, and/orthe like. For example, a Vpass reduction may be a linear function ofboth the time difference between when a sampled data unit was writtenand when an unsampled data unit was written and the bit count of thesampled data unit. Thus, the closer the sampled and unsampled units arein time, the closer the charge loss estimations of the sampled unit willbe to the unsampled unit.

In some examples, the charge loss compensation scheme selected for aparticular page as a result of the background process may be applied toevery read. In other examples, the charge loss compensation schemeselected for a particular page as a result of the background process maybe applied only when a normal read of that page results in an error. Instill other examples, the charge loss compensation scheme selected for aparticular page as a result of the background process may be appliedwhen executing a special inline charge loss compensation read command.For example, a page may store data that may be sensitive data that needsto be read correctly or may be determined by the controller to be moreprone to charge loss effects. In these examples, the inline charge losscompensation read may first apply the charge loss compensation schemeestimated using the background process. If the page is not correctlyread (e.g., does not pass ECC checks), then the charge loss estimationprocess may be specifically applied for that particular unit of data(e.g., page) that is being read. The updated charge loss estimation isused to determine an updated charge loss compensation scheme, which isthen used when retrying the read operation.

FIG. 7 illustrates a flowchart of a method 700 for an inline charge losscompensation read command according to some examples of the presentdisclosure. The inline charge loss compensation (CLC) read may begin atoperation 715 where the controller enables a CLC read. The controllermay enable a CLC read on a unit of data based upon a command from a hostdevice, as a result of errors previously reading the unit of data (e.g.,a number of errors exceeding a threshold), a determination that the datais likely to be affected by charge loss, the data is important data, orthe like. The controller may determine that the data is likely affectedby charge loss in a variety of ways. For example, if the data is randomaccess data, if the age of the data stored in a page is past a thresholdage, and/or the like.

Once the controller determines that a CLC read is to be executed atoperation 715, flow proceeds to operation 712 in which the charge losscompensation scheme is determined. For example, the background processmay have estimated the charge loss of one or more selected data units.If the CLC read request is not requesting to read one of the selecteddata units, the charge loss compensation scheme may be estimated for thedata units requested to be read by the CLC read request based upon theselected data units. This estimation may be done when the backgroundcharge loss estimation (e.g., FIG. 6) is performed and stored (in whichcase operation 712 reads this estimation out of storage) or may be doneat operation 712.

At operation 720, the controller than causes a read operation to beexecuted using the parameters of the charge loss compensation schemedetermined at operation 712. For example, using a reference readvoltage, a Vpass voltage adjustment, and the like.

At operation 725, a check is made to determine if the read resulted inECC errors that exceed a threshold. That is, whether the ECC produceduncorrectable errors (e.g., too many bit errors). If not, then atoperation 730, the system proceeds to a next operation (e.g., a nextread operation). Otherwise, an error handling flow may be started byexecuting an error handling charge loss estimation process 722. Anexample error handling charge loss estimation process 722 is shown inFIG. 6. An error handling charge loss estimation process 722 may be asame process as the charge loss estimation process 712, except that theerror handling charge loss estimation process 722 may be executed on theactual unit of data that is subject of the CLC read request, rather thanusing an estimate based upon a different unit of data (as in thebackground process). Once the charge loss estimation process 712completes, a read is tried again at operation 720 using the updatedcharge loss compensation scheme determined from the charge lossestimation process 712.

As previously described, the read at operation 720 first used the valueof the unit of data estimated by the background CLC estimation process.If executing a read command with those parameters results in an ECClimit being exceeded, the specific charge loss value of the specificunit of data being read may be estimated and used to select a morerefined charge loss compensation scheme. The read is then retried.

Throughout the various procedures described herein, charge loss forvarious data units are estimated and charge loss compensation parametersdetermined based upon those estimations. Whether through a backgroundprocess or via a CLC read, the results of these operations (either thecharge loss estimation or the charge loss compensation parameters) maybe stored in the memory device for later usage. This storage may be in aregister, a cache, a RAM, a working memory, or in the non-volatilememory (e.g., the NAND) itself.

FIG. 8 illustrates a flowchart of a method 800 of performing a readoperation according to some examples of the present disclosure. Method800 is one example of methods 600 and 700 according to some examples. Atoperation 810, the memory device may receive a read command for a unitof data. For example, a read command for a page of data. At operation815, the controller may determine whether to apply a CLC read. Forexample, the unit of data may be stored in a random access fashion (asopposed to sequentially) which may indicate a higher charge losspotential and thus may indicate that a CLC read should be performed. Inother examples, a host may specify that the data is to be read using aCLC read.

If the CLC read operation is not performed, then the read may proceed asnormal. If, on the other hand, the CLC read is to be applied, then atoperation 820, the controller may set a read parameter based upon anestimated charge loss of the page (e.g., on a count or estimate of anumber of bits in the page that are read after applying a reference readvoltage level). Example read parameters may include a read-retryparameter (e.g., a voltage to use on a read-retry if needed), a Vpassvoltage, a reference voltage, and the like. At operation 830, thecontroller may cause the data unit to be read using the read parameterchosen at operation 820. In some examples, at operation 820 the readparameter may be set using estimates of the charge loss of one or moreselected data units.

FIG. 9 illustrates a method 900 of performing a background charge lossestimation process according to some examples of the present disclosure.At operation 910, one or more sample portions of the memory device maybe selected. For example, cells that are more likely to suffer fromcharge loss—such as random-access cells. In other examples, cells thathave been programmed for a certain time. For example, cells may beselected that were written at a first time, a second time, a third time,and the like. In these examples, charge loss in non-selected cells maybe estimated by using a selected cell that was written at a time closestto the non-selected cells. For example, if cells at times x, y, and zare selected for charge loss estimation during a background scan, a cellthat was written at a time closer to x than y or z may use the chargeloss estimation of one or more cells that were sampled that were writtenat time x to set or estimate charge loss.

At operation 915, for each sampled portion of the memory device, thecharge loss estimation process of FIG. 6 may be performed to estimatethe charge loss. The results of the charge loss estimation compensationprocess flow may be stored on the memory device in an area correspondingto or associated with the sampled portion or may be stored in adifferent area with an indication of which memory cells were sampled, orwhat their characteristics are. At operation 920, a charge losscompensation scheme for one or more other data portions that were notselected may be determined based upon the charge loss estimated from theselected portion. Operation 920 may be performed immediately afteroperation 915 or may be performed when a read request is handled for oneof the non-selected portions. The read request may be a regular readrequest, a CLC read request, or a read-retry of a read request.

The charge loss estimate or charge loss compensation scheme that wasdetermined using FIG. 9 may be used when a subsequent read is appliedfor one of the selected cells and/or unselected cells using an estimatedCL based upon the selected cells. For example, the read may apply one ormore parameters of the charge loss compensation scheme that wasdetermined or estimated. In other examples, the CLC parameters may beapplied as a read-retry option if the initial read fails.

FIG. 10 illustrates a block diagram of an example machine 1000 uponwhich any one or more of the techniques (e.g., methodologies) discussedherein may be performed. For example, any of the described memory unitsof example machine 1000 (main memory 1004, static memory 1006, and/ormass storage 1021) may be implemented through memory implementing chargeloss compensation functionality techniques such as those discussedrelative to FIGS. 5-9 herein. In alternative embodiments, the machine1000 can operate as a standalone device or can be connected (e.g.,networked) to other machines. In a networked deployment, the machine1000 can operate in the capacity of a server machine, a client machine,or both in server-client network environments. In an example, themachine 1000 can act as a peer machine in peer-to-peer (P2P) (or otherdistributed) network environment. The machine 1000 can be a personalcomputer (PC), a tablet PC, a set-top box (STB), a personal digitalassistant (PDA), a mobile telephone, a web appliance, an IoT device,automotive system, a host device, or any machine capable of executinginstructions (sequential or otherwise) that specify actions to be takenby that machine. Components of machine 1000 can be present in a memorydevice (e.g., a processor, main memory, mass storage and the like).Further, while only a single machine is illustrated, the term “machine”shall also be taken to include any collection of machines thatindividually or jointly execute a set (or multiple sets) of instructionsto perform any one or more of the methodologies discussed herein, suchas cloud computing, software as a service (SaaS), other computer clusterconfigurations.

Examples, as described herein, can include, or can operate by, logic,components, devices, packages, modules, mechanisms, or circuitry(hereinafter “circuitry”). Circuitry is a collection (e.g., set) ofcircuits implemented in tangible entities that include hardware (e.g.,simple circuits, gates, logic, etc.). Circuitry membership can beflexible over time and underlying hardware variability. Circuitriesinclude members that can, alone or in combination, perform specifictasks when operating. In an example, hardware of the circuitry can beimmutably designed to carry out a specific operation (e.g., hardwired).In an example, the hardware of the circuitry can include variablyconnected physical components (e.g., execution units, transistors,simple circuits, etc.) including a machine readable medium physicallymodified (e.g., magnetically, electrically, moveable placement ofinvariant massed particles, etc.) to encode instructions of the specificoperation. In connecting the physical components, the underlyingelectrical properties of a hardware constituent are changed, forexample, from an insulator to a conductor or vice versa. Theinstructions enable participating hardware (e.g., the execution units ora loading mechanism) to create members of the circuitry in hardware viathe variable connections to carry out portions of the specific taskswhen in operation. Accordingly, the machine-readable medium iscommunicatively coupled to the other components of the circuitry whenthe device is operating. In an example, any of the physical componentscan be used in more than one member of more than one circuitry. Forexample, under operation, execution units can be used in a first circuitof a first circuitry at one point in time and reused by a second circuitin the first circuitry, or by a third circuit in a second circuitry at adifferent time.

The methods 600, 700, 800, and 900 may be implemented as software—e.g.,as instructions stored on a machine-readable medium (e.g., memory die130, 400, 1021). The instructions, when executed by one or moreprocessors (e.g., 115, 430, 1002), cause the memory device to performthe methods 600,700, 800, and 900.

The machine (e.g., computer system) 1000 (e.g., the host device 135, thememory device 110, etc.) can include a hardware processor 1002 (e.g., acentral processing unit (CPU), a graphics processing unit (GPU), ahardware processor core, or any combination thereof). In some examples,processor 1002 may be the processing circuitry 110 (e.g., processors115), memory control unit 430 and the like. Machine 1000 may include amain memory 1004 and a static memory 1006, some or all of which cancommunicate with each other via an interlink (e.g., bus) 1008. Mainmemory 1004 and/or static memory 1006 may be the random access memory120. The machine 1000 can further include a display device 1010, aninput device 1012 (e.g., a keyboard), and a user interface (UI)navigation device 1014 (e.g., a mouse). In an example, the displaydevice 1010, input device 1012 and UI navigation device 1014 can be atouch screen display. The machine 1000 can additionally include a massstorage device (e.g., drive unit) 1021, a signal generation device 1018(e.g., a speaker), a network interface device 1020, and one or moresensors 1016, such as a global positioning system (GPS) sensor, compass,accelerometer, or other sensor. The machine 1000 can include an outputcontroller 1028, such as a serial (e.g., universal serial bus (USB),parallel, or other wired or wireless (e.g., infrared (IR), near fieldcommunication (NFC), etc.) connection to communicate or control one ormore peripheral devices (e.g., a printer, card reader, etc.). Portionsof machine 1000 may be included in memory device 100 and portions ofmachine 1000 may be examples of components of memory device 100.

Mass storage device 1021 may be a memory device such as memory device100 described in FIG. 1 or one or more memory dies 130, 400. The massstorage device 1021 can include a machine readable medium 1022 on whichis stored one or more sets of data structures or instructions 1024(e.g., software) embodying or utilized by any one or more of thetechniques or functions described herein. The instructions 1024 can alsoreside, completely or at least partially, within the main memory 1004,within static memory 1006, or within the hardware processor 1002 duringexecution thereof by the machine 1000. In an example, one or anycombination of the hardware processor 1002, the main memory 1004, thestatic memory 1006, or the mass storage device 1021 can constitute themachine readable medium 1022. Machine readable medium 1022 and theinstructions 1024 may be stored on the memory device 100, memory dies130, 400, random access memory 120 (which may be main memory 1004 orstatic memory 1006), processing circuitry 110, processors 115, and thelike.

While the machine readable medium 1022 is illustrated as a singlemedium, the term “machine readable medium” can include a single mediumor multiple media (e.g., a centralized or distributed database, orassociated caches and servers) configured to store the one or moreinstructions 1024. The machine-readable medium may be a non-transitorymachine readable medium.

The term “machine readable medium” can include any medium capable ofstoring, encoding, or carrying instructions for execution by the machine1000 and that cause the machine 1000 to perform any one or more of thetechniques of the present disclosure, or capable of storing, encoding orcarrying data structures used by or associated with such instructions.Non-limiting machine-readable medium examples can include solid-statememories, and optical and magnetic media. In an example, a massedmachine-readable medium comprises a machine-readable medium with aplurality of particles having invariant (e.g., rest) mass. Accordingly,massed machine-readable media are not transitory propagating signals.Specific examples of massed machine-readable media can include:non-volatile memory, such as semiconductor memory devices (e.g.,Electrically Programmable Read-Only Memory (EPROM), ElectricallyErasable Programmable Read-Only Memory (EEPROM)) and flash memorydevices; magnetic disks, such as internal hard disks and removabledisks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

The instructions 1024 (e.g., software, programs, an operating system(OS), etc.) or other data are stored on the storage device 1021, can beaccessed by the memory 1004 for use by the processor 1002. The memory1004 (e.g., DRAM) is typically fast, but volatile, and thus a differenttype of storage than the mass storage device 1021 (e.g., a memory device100), which is suitable for long-term storage, including while in an“off” condition. The instructions 1024 or data in use by a user or themachine 1000 are typically loaded in the memory 1004 for use by theprocessor 1002. When the memory 1004 is full, virtual space from themass storage device 1021 can be allocated to supplement the memory 1004;however, because the mass storage device 1021 is typically slower thanthe memory 1004, and write speeds are typically at least twice as slowas read speeds, use of virtual memory can greatly reduce user experiencedue to storage device latency (in contrast to the memory 1004, e.g.,DRAM). Further, use of the mass storage device 1021 for virtual memorycan greatly reduce the usable lifespan of the storage device 1021.

In contrast to virtual memory, virtual memory compression (e.g., theLinux® kernel feature “ZRAM”) uses part of the memory as compressedblock storage to avoid paging to the mass storage device 1021. Pagingtakes place in the compressed block until it is necessary to write suchdata to the mass storage device 1021. Virtual memory compressionincreases the usable size of memory 1004, while reducing wear on themass storage device 1021.

Storage devices optimized for mobile electronic devices, or mobilestorage, traditionally include MMC solid-state storage devices (e.g.,micro Secure Digital (microSD™) cards, etc.). MMC devices include anumber of parallel interfaces (e.g., an 8-bit parallel interface) with ahost device and are often removable and separate components from thehost device. In contrast, eMMC™ devices are attached to a circuit boardand considered a component of the host device, with read speeds thatrival serial ATA™ (Serial AT (Advanced Technology) Attachment, or SATA)based SSD devices. However, demand for mobile device performancecontinues to increase, such as to fully enable virtual oraugmented-reality devices, utilize increasing networks speeds, etc. Inresponse to this demand, storage devices have shifted from parallel toserial communication interfaces. Universal Flash Storage (UFS) devices,including controllers and firmware, communicate with a host device usinga low-voltage differential signaling (LVDS) serial interface withdedicated read/write paths, further advancing greater read/write speeds.

The instructions 1024 can further be transmitted or received over acommunications network 1026 using a transmission medium via the networkinterface device 1020 utilizing any one of a number of transferprotocols (e.g., frame relay, internet protocol (IP), transmissioncontrol protocol (TCP), user datagram protocol (UDP), hypertext transferprotocol (HTTP), etc.). Example communication networks can include alocal area network (LAN), a wide area network (WAN), a packet datanetwork (e.g., the Internet), mobile telephone networks (e.g., cellularnetworks), Plain Old Telephone (POTS) networks, and wireless datanetworks (e.g., Institute of Electrical and Electronics Engineers (IEEE)802.11 family of standards known as Wi-Fi®, IEEE 802.16 family ofstandards known as WiMax®), IEEE 802.15.4 family of standards,peer-to-peer (P2P) networks, among others. In an example, the networkinterface device 1020 can include one or more physical jacks (e.g.,Ethernet, coaxial, or phone jacks) or one or more antennas to connect tothe communications network 1026. In an example, the network interfacedevice 1020 can include a plurality of antennas to wirelesslycommunicate using at least one of single-input multiple-output (SIMO),multiple-input multiple-output (MIMO), or multiple-input single-output(MISO) techniques. The term “transmission medium” shall be taken toinclude any intangible medium capable of storing, encoding or carryinginstructions for execution by the machine 1000, and includes digital oranalog communications signals or other intangible medium to facilitatecommunication of such software.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which theinvention can be practiced. These embodiments are also referred toherein as “examples”. Such examples can include elements in addition tothose shown or described. However, the present inventors alsocontemplate examples in which only those elements shown or described areprovided. Moreover, the present inventors also contemplate examplesusing any combination or permutation of those elements shown ordescribed (or one or more aspects thereof), either with respect to aparticular example (or one or more aspects thereof), or with respect toother examples (or one or more aspects thereof) shown or describedherein.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” can include “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In the appended claims, the terms “including” and“in which” are used as the plain-English equivalents of the respectiveterms “comprising” and “wherein”. Also, in the following claims, theterms “including” and “comprising” are open-ended, i.e., a system,device, article, or process that includes elements in addition to thoselisted after such a term in a claim are still deemed to fall within thescope of that claim. Moreover, in the following claims, the terms“first,” “second,” and “third,” etc. are used merely as labels, and arenot intended to impose numerical requirements on their objects.

In various examples, the components, controllers, processors, units,engines, or tables described herein can include, among other things,physical circuitry or firmware stored on a physical device. As usedherein, “processor” means any type of computational circuit such as, butnot limited to, a microprocessor, a microcontroller, a graphicsprocessor, a digital signal processor (DSP), or any other type ofprocessor or processing circuit, including a group of processors ormulti-core devices.

Various embodiments according to the present disclosure and describedherein include memory utilizing a vertical structure of memory cells(e.g., NAND strings of memory cells). As used herein, directionaladjectives will be taken relative a surface of a substrate upon whichthe memory cells are formed (i.e., a vertical structure will be taken asextending away from the substrate surface, a bottom end of the verticalstructure will be taken as the end nearest the substrate surface and atop end of the vertical structure will be taken as the end farthest fromthe substrate surface).

As used herein, directional adjectives, such as horizontal, vertical,normal, parallel, perpendicular, etc., can refer to relativeorientations, and are not intended to require strict adherence tospecific geometric properties, unless otherwise noted. For example, asused herein, a vertical structure need not be strictly perpendicular toa surface of a substrate, but can instead be generally perpendicular tothe surface of the substrate, and can form an acute angle with thesurface of the substrate (e.g., between 60 and 120 degrees, etc.).

In some embodiments described herein, different doping configurationscan be applied to a source-side select gate (SGS), a control gate (CG),and a drain-side select gate (SGD), each of which, in this example, canbe formed of or at least include polysilicon, with the result such thatthese tiers (e.g., polysilicon, etc.) can have different etch rates whenexposed to an etching solution. For example, in a process of forming amonolithic pillar in a 3D semiconductor device, the SGS and the CG canform recesses, while the SGD can remain less recessed or even notrecessed. These doping configurations can thus enable selective etchinginto the distinct tiers (e.g., SGS, CG, and SGD) in the 3D semiconductordevice by using an etching solution (e.g., tetramethylammonium hydroxide(TMCH)).

Operating a memory cell, as used herein, includes reading from, writingto, or erasing the memory cell. The operation of placing a memory cellin an intended state is referred to herein as “programming,” and caninclude both writing to or erasing from the memory cell (e.g., thememory cell can be programmed to an erased state).

It will be understood that when an element is referred to as being “on,”“connected to” or “coupled with” another element, it can be directly on,connected, or coupled with the other element or intervening elements canbe present. In contrast, when an element is referred to as being“directly on,” “directly connected to” or “directly coupled with”another element, there are no intervening elements or layers present. Iftwo elements are shown in the drawings with a line connecting them, thetwo elements can be either be coupled, or directly coupled, unlessotherwise indicated.

Method examples described herein can be machine or computer-implementedat least in part. Some examples can include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure an electronic device to perform methods as described in theabove examples. An implementation of such methods can include code, suchas microcode, assembly language code, a higher-level language code, orthe like. Such code can include computer readable instructions forperforming various methods. The code can form portions of computerprogram products. Further, the code can be tangibly stored on one ormore volatile or non-volatile tangible computer-readable media, such asduring execution or at other times. Examples of these tangiblecomputer-readable media can include, but are not limited to, hard disks,removable magnetic disks, removable optical disks (e.g., compact discsand digital video disks), magnetic cassettes, memory cards or sticks,random access memories (RAMs), read only memories (ROMs), solid statedrives (SSDs), Universal Flash Storage (UFS) device, embedded MMC (eMMC)device, and the like.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) can be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features can be grouped together to streamline the disclosure.This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter canlie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment, and it is contemplated that such embodiments can be combinedwith each other in various combinations or permutations. The scope ofthe invention should be determined with reference to the appendedclaims, along with the full scope of equivalents to which such claimsare entitled.

OTHER NOTES AND EXAMPLES

Example 1 is a memory system comprising: a memory array comprisingnon-volatile memory cells; a memory controller comprising one or morehardware processors, the memory controller configured to performoperations comprising: receiving a read command to read a page of thememory array; determining whether a charge loss compensation is to beapplied for the read command; responsive to determining that the chargeloss compensation is to be applied to the read command, setting a readparameter based upon an estimated charge loss of the page; and readingthe page using the read parameter and a read voltage, the read voltagedifferent than the reference read level voltage.

In Example 2, the subject matter of Example 1 includes, wherein theoperations of setting the read parameter based upon the estimated chargeloss of the page comprises: estimating a charge loss of a second page bycounting a number of bits read in the second page resulting fromapplying a defined read voltage; and setting the read parameter basedupon the estimated charge loss of the second page.

In Example 3, the subject matter of Example 2 includes, wherein theoperations of estimating the charge loss are performed prior toreceiving the read command as a background process.

In Example 4, the subject matter of Examples 1-3 includes, wherein theread parameter is a Vpass voltage.

In Example 5, the subject matter of Examples 1-4 includes, wherein theread parameter is a read-retry parameter.

In Example 6, the subject matter of Examples 1-5 includes, wherein theread parameter is a read-retry parameter and a Vpass voltage.

In Example 7, the subject matter of Examples 1-6 includes, wherein theoperations of determining whether the charge loss compensation is to beapplied comprises: determining a classification for data in a block inwhich the page is stored as either random access or sequential; andresponsive to determining that the data in the block is random access,determining to apply the charge loss compensation feature.

In Example 8, the subject matter of Examples 1-7 includes, wherein theone or more hardware processors are configured to execute instructionsstored in the memory system, and when executed, cause the one or moreprocessors to perform the operations.

Example 9 is a method performed by a controller of a memory system, themethod comprising: receiving a read command to read a page of a memoryarray; determining whether a charge loss compensation is to be appliedfor the read command; responsive to determining that the charge losscompensation is to be applied to the read command, setting a readparameter based upon an estimated charge loss of the page; and readingthe page using the read parameter and a read voltage, the read voltagedifferent than the reference read level voltage.

In Example 10, the subject matter of Example 9 includes, wherein settingthe read parameter based upon the estimated charge loss of the pagecomprises: estimating a charge loss of a second page by counting anumber of bits read in the second page resulting from applying a definedread voltage; and setting the read parameter based upon the estimatedcharge loss of the second page.

In Example 11, the subject matter of Example 10 includes, whereinestimating the charge loss are performed prior to receiving the readcommand as a background process.

In Example 12, the subject matter of Examples 9-11 includes, wherein theread parameter is a Vpass voltage.

In Example 13, the subject matter of Examples 9-12 includes, wherein theread parameter is a read-retry parameter.

In Example 14, the subject matter of Examples 9-13 includes, wherein theread parameter is a read-retry parameter and a Vpass voltage.

In Example 15, the subject matter of Examples 9-14 includes, whereindetermining whether a charge loss compensation feature is to be appliedcomprises: determining a classification for data in a block in which thepage is stored as either random access or sequential; and responsive todetermining that the data in the block is random access, determining toapply the charge loss compensation feature.

Example 16 is a non-transitory machine-readable medium, storinginstructions, which when executed by a processor of a memory system,causes the processor to perform operations comprising: receiving a readcommand to read a page of the memory array; determining whether a chargeloss compensation is to be applied for the read command; responsive todetermining that the charge loss compensation is to be applied to theread command, setting a read parameter based upon an estimated chargeloss of the page; and reading the page using the read parameter and aread voltage, the read voltage different than the reference read levelvoltage.

In Example 17, the subject matter of Example 16 includes, wherein theoperations of setting the read parameter based upon the estimated chargeloss of the page comprises: estimating a charge loss of a second page bycounting a number of bits read in the second page resulting fromapplying a defined read voltage; and setting the read parameter basedupon the estimated charge loss of the second page.

In Example 18, the subject matter of Example 17 includes, wherein theoperations of estimating the charge loss are performed prior toreceiving the read command as a background process.

In Example 19, the subject matter of Examples 16-18 includes, whereinthe read parameter is a Vpass voltage.

In Example 20, the subject matter of Examples 16-19 includes, whereinthe read parameter is a read-retry parameter.

Example 21 is at least one machine-readable medium includinginstructions that, when executed by processing circuitry, cause theprocessing circuitry to perform operations to implement of any ofExamples 1-20.

Example 22 is an apparatus comprising means to implement of any ofExamples 1-20.

Example 23 is a system to implement of any of Examples 1-20.

Example 24 is a method to implement of any of Examples 1-20.

The invention claimed is:
 1. A memory system comprising: a memory arraycomprising non-volatile memory cells; a memory controller comprising oneor more hardware processors, the memory controller configured to performoperations comprising: applying a first read voltage to a first page ofthe memory array; determining a number of bits read in the first page asa result of the application of the first read voltage; estimating acharge loss of a second page based upon the number of bits and aproximity between the first and second pages; receiving a read commandto read the second page of the memory array; determining whether acharge loss compensation is to be applied for the read command;responsive to determining that the charge loss compensation is to beapplied to the read command, setting a read parameter based upon theestimated charge loss of the second page; and reading the second pageusing the read parameter and a second read voltage, the second readvoltage different than a reference read level voltage.
 2. The memorysystem of claim 1, wherein the operations of estimating the charge lossare performed prior to receiving the read command as a backgroundprocess.
 3. The memory system of claim 1, wherein the read parameter isa Vpass voltage.
 4. The memory system of claim 1, wherein the readparameter is a read-retry parameter.
 5. The memory system of claim 1,wherein the read parameter comprises a read-retry parameter and a Vpassvoltage.
 6. The memory system of claim 1, wherein the operations ofdetermining whether the charge loss compensation is to be appliedcomprises: determining a classification for data in a block in which thefirst page is stored as either random access or sequential; andresponsive to determining that the data in the block is random access,determining to apply the charge loss compensation feature.
 7. The memorysystem of claim 1, wherein the one or more hardware processors areconfigured to execute instructions stored in the memory system, and whenexecuted, cause the one or more processors to perform the operations. 8.A method performed by a controller of a memory system, the methodcomprising: applying a first read voltage to a first page of a memoryarray of the memory system; determining a number of bits read in thefirst page as a result of the application of the first read voltage;estimating a charge loss of a second page based upon the number of bitsand a proximity between the first and second pages; receiving a readcommand to read the second page of the memory array; determining whethera charge loss compensation is to be applied for the read command;responsive to determining that the charge loss compensation is to beapplied to the read command, setting a read parameter based upon theestimated charge loss of the second page; and reading the second pageusing the read parameter and a second read voltage, the second readvoltage different than a reference read level voltage.
 9. The method ofclaim 8, wherein estimating the charge loss is performed prior toreceiving the read command as a background process.
 10. The method ofclaim 8, wherein the read parameter is a Vpass voltage.
 11. The methodof claim 8, wherein the read parameter is a read-retry parameter. 12.The method of claim 8, wherein the read parameter comprises a read-retryparameter and a Vpass voltage.
 13. The method of claim 8, whereindetermining whether a charge loss compensation feature is to be appliedcomprises: determining a classification for data in a block in which thesecond page is stored as either random access or sequential; andresponsive to determining that the data in the block is random access,determining to apply the charge loss compensation feature.
 14. Anon-transitory machine-readable medium, storing instructions, which whenexecuted by a processor of a memory system, causes the processor toperform operations comprising: applying a first read voltage to a firstpage of a memory array of the memory system; determining a number ofbits read in the first page as a result of the application of the firstread voltage; estimating a charge loss of a second page based upon thenumber of bits and a proximity between the first and second pages;receiving a read command to read the second page of the memory array;determining whether a charge loss compensation is to be applied for theread command; responsive to determining that the charge losscompensation is to be applied to the read command, setting a readparameter based upon the estimated charge loss of the second page; andreading the second page using the read parameter and a second readvoltage, the second read voltage different than a reference read levelvoltage.
 15. The non-transitory machine-readable medium of claim 14,wherein the operations of estimating the charge loss are performed priorto receiving the read command as a background process.
 16. Thenon-transitory machine-readable medium of claim 14, wherein the readparameter is a Vpass voltage.
 17. The non-transitory machine-readablemedium of claim 14, wherein the read parameter is a read-retryparameter.